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Reactive bonding with integrated reactive and nano scale energetic material systems (iRMS): State-of-the-art and future development trends

: Braeuer, J.; Besser, J.; Hertel, S.; Masser, R.; Schneider, W.; Wiemer, M.; Gessner, T.


Moriceau, H. ; Electrochemical Society -ECS-:
Semiconductor Wafer Bonding 13. Science, Technology, and Applications : Held in Cancun, Mexico, as part of the 226th Meeting of the Electrochemical Society, in conjunction with the XXIX Congreso de la Sociedad Mexicana de Electroquimica, from October 5 to 9, 2014
Pennington, NJ: ECS, 2014 (ECS transactions 64. 2014, Nr.5)
ISBN: 978-1-62332-185-7
ISBN: 978-1-60768-542-5
International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications <13, 2014, Cancun>
Electrochemical Society (Meeting) <226, 2014, Cancun>
Sociedad Mexicana de Electroquimica (Congreso) <29, 2014, Cancun>
Fraunhofer ENAS ()

This paper introduces different principles and deposition methods that use a specific form of local heat generation. Such systems consist of integrated and nano scale energetic material systems. These materials generate heat based on a self-propagating exothermic reaction during inter diffusion. The resulting heat can be used as heat source for bonding processes.