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Stress controlled CMUT fabrication based on a CMOS compatible sacrificial release process

: Elsäßer, Linus; Friedrichs, Martin; Klemm, Markus; Unamuno, Anartz


Benoit, Charlot; Mita, Yoshio; Nouet, Pascal; Pressecq, Francis; Schröpfer, Gerold; Rencz, Marta; Schneider, Peter ; Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
DTIP 2015, 17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS : 27 - 30 April 2015, Montpellier, France
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-8627-9
ISBN: 978-1-4799-8545-6
ISBN: 978-1-4799-8625-5
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS <17, 2015, Montpellier>
Fraunhofer IPMS ()

We report a stress control method for Capacitive Micromachined Ultrasonic Transducers (CMUTs) fabricated with sacrificial release process. By annealing a TiAl plate the stress can be shifted from compressive to tensile and its behavior is visualized over temperature and time. Furthermore, a linear dependency of annealing temperature and stress is shown, allowing uncomplicated stress adjustment. Remaining deflection can be explained by both atmospheric pressure and temperature influence of the final process steps. Mechanical long term stability is proven with stress measurements over several months.