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Enabling automatic system design optimization through assembly design kits

 
: Heinig, Andy; Fischbach, Robert

:

Institute of Electrical and Electronics Engineers -IEEE-:
IEEE International 3D Systems Integration Conference, 3DIC 2015 : 31 August - 02 September 2015, Sendai, Japan
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4673-9384-3
S.280-284
International 3D Systems Integration Conference (3DIC) <2015, Sendai>
Bundesministerium für Bildung und Forschung BMBF
IKT 2020 - Forschung für Innovation; 16M3201B; ESiMED
Englisch
Konferenzbeitrag
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Abstract
This paper presents concepts for the implementation of Assembly Design Kits (ADKs) to enable a better assembly and packaging design automation. Both directions of data exchange (from manufacturing to design and vice versa) are important to improve the collaboration between design and manufacturing. A flexible data format is fundamental to reveal manufacturing requirements to a designer as well as to transfer design data into manufacturing.

: http://publica.fraunhofer.de/dokumente/N-364016.html