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Local pre-curing of an adhesive for the fabrication of shaped piezo-metal-compounds

Lokale Klebstoffaushärtung zur Herstellung umgeformter Piezo-Metall-Verbunde
: Drossel, Welf-Guntram; Müller, Roland; Ihlemann, J.; Rudolph, M.; Hensel, Sebastian; Nestler, Matthias

Drossel, Welf-Guntram ; TU Chemnitz, Institut für Werkzeugmaschinen und Produktionsprozesse:
5th Scientific Symposium "Lightweight Design by Integration Functions" 2015 : 14.-16. September 2015, Dresden
Dresden, 2015
ISBN: 978-3-00-050383-2
Scientific Symposium "Lightweight Design by Integration Functions" <5, 2015, Dresden>
Fraunhofer IWU ()
local curing; adhesive; Thermal simulation

In this contribution experimental and simulative aspects of a novel method for the production of piezo-metal-compounds are presented in order to enhance the series capability of their former manufacturing process. These compounds are sandwich constructions with a piezomodule between two aluminum sheets. Until recently a still liquid adhesive surrounded the piezomodule to protect it from damage during forming of the compound and an already solidified adhesive in the outer regions assured the patch fixation. Now the studied novel method employs only one adhesive which takes over both functions at the same time. In order to assure this double function a local pre-curing is pursued. The paper focuses on the local activation of the curing reaction of adhesives using higher temperatures. Hence, a device with a heating and a cooling zone was employed to adjust different temperature fields within one bonded sandwich sheet. Finally, sandwich compounds with partially cured and partially liquid areas of adhesive are manufactured. Moreover, a thermo-chemically coupled continuum mechanical model for adhesives is implemented into ANSYS® and allows for finite element analysis of this spatially graded curing with its heat flow caused by both, local activation and exothermal reaction heat. Hence, alternative production strategies can be evaluated at an early stage of the process development.