Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Thermal and mechanical simulations for the improvement of the lifespan of highly-integrated systems

: Heinig, Andy; Papaioannou, Dimitrios

VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
Zuverlässigkeit und Entwurf - Reliability by Design : Beiträge der 8. GMM/ITG/GI-Fachtagung, 21. – 23. September 2015 in Siegen, ZuE 2015; CD-ROM
Berlin: VDE-Verlag, 2015 (GMM-Fachbericht 83)
ISBN: 978-3-8007-4071-0
ISBN: 3-8007-4071-0
Fachtagung "Zuverlässigkeit und Entwurf" (ZuE) <8, 2015, Siegen>
Bundesministerium für Bildung und Forschung BMBF
IKT 2020 - Forschung für Innovation; 16M3201B; ESiMED
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

The thermal and mechanical behaviour is a critical aspect for electronic devices in general and for highly-integrated sys-tem in particular. In this paper we present different approaches based on simulations for the improvement of the lifespan of highly-integrated systems. As an example we applied our methods to an implantable stent with integrated electronics. The outcome of our work enables further design decisions in relation to the medical boundary conditions. Here we focus on the qualitative predictions with regard to mechanical and thermal stability. Furthermore, we suggest several design and technology related actions which can be taken to improve the mechanical and thermal behaviour of the investigated system. These suggestions concern, for example, the implementation of microbumps, a stress-relief layer for stress reduction or a silicone rubber that encapsulates the incorporated electronics in order to achieve better mechanical and thermal conditions.