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Mechanisms of low-temperature wafer bonding
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2005
Conference Paper
Titel
Mechanisms of low-temperature wafer bonding
Author(s)
Reiche, M.
Radu, I.
Gabriel, M.
Zoberbier, M.
Hansen, S.
Eichler, M.
Hauptwerk
Semiconductor wafer bonding VIII. Science, technology, and applications
Konferenz
International Symposium on Semiconductor Wafer Bonding - Science, Technology, and Applications 2005
Electrochemical Society (Spring Meeting) 2005
Language
English
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Fraunhofer-Institut für Schicht- und Oberflächentechnik IST