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A novel modelling methodology of bump arrays for RF and high-speed applications

: Ndip, I.; Sommer, G.; John, W.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
International Symposium on Microelectronics 2003. Proceedings : November 18 - 20, 2003, Hynes Convention Center, Boston, MA
Washington, DC: IMAPS, 2003 (SPIE Proceedings Series 5288)
ISBN: 0-930815-71-8
ISBN: 0-8194-5189-4
International Symposium on Microelectronics <36, 2003, Boston/Mass.>
Fraunhofer IZM ()

A novel methodology for electrical modelling of bump arrays up to a frequency of 30GHz is presented. It starts with the development of an equivalent circuit model for a single bump. Based on the radio frequency (RF) modelling of this bump, equivalent circuit models were developed for any two parallel or diagonal bumps, which account for their electromagnetic (EM) interactions. These models were then extended to characterise three-coupled bumps in linear and triangular configurations. For these bump arrangements, it was proven, that considering pitches used in RF and high-speed packages, effects of EM coupling between outwardly-placed bumps on EM interaction between the adjacent ones can be neglected. It is actually on this basis, that a combination of all the electrical models developed can be used to characterise any bump array, irrespective of the number of bumps in the array. This was validated using a bump array consisting of four-coupled bumps.