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Rapid determination of organic contaminations on wafer surfaces

 
: Meyer, S.; Timmel, S.; Hagendorf, C.

:

Mertens, P.:
Ultra clean processing of semiconductor surfaces XII : Selected, peer reviewed papers from the 12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 21-24, 2014, Brussels, Belgium
Pfaffikon: TTP, 2015 (Defect and diffusion forum. Diffusion and defect data 219)
ISBN: 978-3-03835-242-6
ISBN: 978-3-03826-626-6 (eBook)
S.317-319
International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) <12, 2014, Brussels>
Englisch
Konferenzbeitrag
Fraunhofer CSP ()

Abstract
Irrespective of the semiconductor type and technology, organic contaminations on wafer surfaces have a detrimental impact on subsequent manufacturing steps and/or the device function. Therefore, it is of great interest to have a quick and reliable tool to detect those contaminations with sufficient sensitivity. In this study we investigated and optimized two methods which have the potential for in-line analytics since they are fast and simple: contact angle measurement and total organic carbon (TOC) determination. We present data on silicon wafer surfaces; however, the techniques may be suitable for all other wafer surfaces, too.

: http://publica.fraunhofer.de/dokumente/N-352322.html