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Multi-chip integration of lasers and silicon photonics by photonic wire bonding

 
: Billah, M.; Hoose, T.; Onanuga, T.; Lindenmann, N.; Dietrich, P.; Wingert, T.; Goedecke, M.; Hofmann, A.; Troppenz, U.; Möhrle, M.; Sigmund, A.; Freude, W.; Koos, C.

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Optical Society of America -OSA-, Washington/D.C.:
CLEO: Science and Innovations : Part of Conference on Lasers and Electro-Optics; 10 - 15 May 2015, San Jose, California, United States
Washington, DC: OSA, 2015 (OSA Technical digest series)
ISBN: 978-1-55752-968-8
Paper STu2F.2
Conference on Lasers and Electro-Optics - Science and Innovations (CLEO SI) <2015, San Jose/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer HHI ()

Abstract
We demonstrate coupling of a horizontal-cavity surface-emitting laser (HCSEL) to a silicon photonic chip using photonic wire bonding. The technique does not require high-precision alignment of the chips. Measured coupling losses amount to approximately 4.2 dB.

: http://publica.fraunhofer.de/dokumente/N-352289.html