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Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding

: Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Schneider-Ramelow, M.; Lang, K.-D.


Microelectronics reliability 55 (2015), Nr.9-10, S.1855-1860
ISSN: 0026-2714
European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) <26, 2015, Toulouse>
Zeitschriftenaufsatz, Konferenzbeitrag
Fraunhofer IZM ()

Three different heavy aluminum wire qualities were investigated regarding their microstructural evolution after ultrasonic bonding by electron backscatter diffraction and nanoindentation. The results complete the findings of our recent research regarding the effect of bonding mechanisms on the wire bond microstructure and its local mechanical properties. Local elastic-plastic material parameters of the bonded wires were approximated on the basis of the elastic anisotropy of crystals and a correlation between hardness and stress.