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Packaging for power semiconductors based on the 3D printing technology selective laser melting

: Conrad, M.; Doncker, R.W. de; Schniedenharn, M.; Diatlov, A.


Institute of Electrical and Electronics Engineers -IEEE-:
16th European Conference on Power Electronics and Applications, EPE-ECCE Europe 2014. Vol.3 : Lappeenranta, Finland, 26 - 28 August 2014
Piscataway, NJ: IEEE, 2014
ISBN: 978-1-4799-3015-9
ISBN: 978-1-4799-3016-6
European Conference on Power Electronics and Applications (EPE) <16, 2014, Lappeenranta>
Energy Conversion Congress and Exposition (ECCE) <2014, Lappeenranta>
Fraunhofer ILT ()

In this paper a new packaging technique based on Selective Laser Melting is presented which tries to replace solder or sinter layers, respectively bond wires. Following the intended contact geometry and concept, simulations show the influence of the contact geometry on the thermo-mechanical stress the device is committed to. First investigations on the constraints of the production process are represented. Finally the feasibility of the proposed packaging technique is shown.