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Nanoporous gold as a versatile bonding intermediate

: Lin, Y.-C.; Wang, W.-S.; Gessner, T.; Esashi, M.


Suga, T. ; Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. Proceedings : 15-16 July 2014, Tokyo, Japan
Piscataway, NJ: IEEE, 2014
ISBN: 978-1-4799-5260-1
ISBN: 978-1-4799-5261-8
ISBN: 978-1-4799-5262-5
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) <4, 2014, Tokyo>
Fraunhofer ENAS ()

On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.