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Comparison of the thermal cycling capability between power modules with DAB and DCB substrates with Al2O3 ceramic

: Poller, T.; Bohlländer, M.; Lutz, J.; Böettge, B.; Grieger, F.; Lindemann, A.; Knoll, H.

MESAGO PCIM GmbH, Stuttgart:
PCIM Europe 2013. Proceedings. CD-ROM : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013
Berlin: VDE-Verlag, 2013
ISBN: 978-3-8007-3505-1
PCIM Europe <2013, Nuremberg>
Fraunhofer IWM ()

In power modules the dies are mounted on substrates which are a ceramic with a metallization on the front and backside. Typically the metallization is copper (DCB substrates). In the last years the interconnections between the dies and the substrate have been improved. Now the substrate (e.g. the interconnection between the ceramic and the metallization) becomes the main weak point which makes an improvement necessary. One option is a replacement of the copper layer with an aluminium layer (DAB substrates). In this paper the results of reliability tests are discussed which compare the capability of DCB and DAB with Al2O3 ceramics.