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Parameters of the manufacturing process and reliability of embedded components

 
: Osmolovskyi, S.; Schwerz, R.; Wolter, K.-J.

:

Institute of Electrical and Electronics Engineers -IEEE-:
ISSE 2013, 36th International Spring Seminar on Electronics Technology "Automotive Electronics". Proceedings : Transylvania, Alba Iulia, on May 8th – 12th, 2013
Piscataway, NJ: IEEE, 2013
ISBN: 978-1-4799-0036-7
S.64-69
International Spring Seminar on Electronics Technology (ISSE) <36, 2013, Alba Iulia>
Englisch
Konferenzbeitrag
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

Abstract
The presented work deals with the reliability issues of embedded components in a PCB core. The process of the embedding technology is discussed in the course of this paper. We showed that the selection of manufacturing parameters strongly influences the quality of the embedding process and therefore the reliability of embedded systems. Results of the researches carried out at different values of decisive parameters are presented. We fabricated prototypes with embedded resistors and capacitors using the technology described in the article and tested them for their reliability. Additionally the effect of temperature and pressure during the manufacturing process on the electrical parameters of embedded components has been studied. As a result, we compared the reliability of PCBs produced by the embedding and the surface-mount technology and evaluated the impact of manufacturing faults on reliability.

: http://publica.fraunhofer.de/dokumente/N-350591.html