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Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
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2013
Conference Paper
Titel
Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
Author(s)
Oliver, M.
Kim, J.-U.
Wang, Z.
Okada, J.
Iagodkine, E.
Choubey, A.
Anzures, E.
Fleming, D.
Dhoble, A.
Truong, C.
Gallagher, M.
Zoschke, K.
Wegner, M.
Töpper, M.
Hauptwerk
9th International Conference and Exhibition on Device Packaging, DPC 2013
Konferenz
International Conference and Exhibition on Device Packaging 2013
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM