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2013
Conference Paper
Titel
Transient Liquid Phase Soldering-An emerging joining technique for power electronic devices
Abstract
The Transient Liquid Phase Soldering (TLPS) is a new lead-free joining technology for power electronic modules in high temperature applications. This alternative solder interconnection technology is based on a phase transformation using a low melting solder powder, like eutectic Sn-based solder, and a high melting powder, e.g. Cu. The bonding temperature of such a TLPS interconnection is in the range of typical Sn-based solders, which is around 240 °C. The resulting interconnection is characterized by an almost void-less joint of Cu6Sn5 and Cu3Sn intermetallic phases. Due to this fact, the re-melting temperature of such a joint can be increased up to the decomposition temperature of the Cu6Sn5 intermetallic phase which is 415 °C. The basic requirements of the joining material and process will be discussed in this study.
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