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Transient Liquid Phase Soldering-An emerging joining technique for power electronic devices

: Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.

MESAGO PCIM GmbH, Stuttgart:
PCIM Europe 2013. Proceedings. CD-ROM : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013
Berlin: VDE-Verlag, 2013
ISBN: 978-3-8007-3505-1
PCIM Europe <2013, Nuremberg>
Fraunhofer IZM ()

The Transient Liquid Phase Soldering (TLPS) is a new lead-free joining technology for power electronic modules in high temperature applications. This alternative solder interconnection technology is based on a phase transformation using a low melting solder powder, like eutectic Sn-based solder, and a high melting powder, e.g. Cu. The bonding temperature of such a TLPS interconnection is in the range of typical Sn-based solders, which is around 240 °C. The resulting interconnection is characterized by an almost void-less joint of Cu6Sn5 and Cu3Sn intermetallic phases. Due to this fact, the re-melting temperature of such a joint can be increased up to the decomposition temperature of the Cu6Sn5 intermetallic phase which is 415 °C. The basic requirements of the joining material and process will be discussed in this study.