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Plasma dicing enables high accuracy self-alignment of thin silicon dies for 3D-device-integration

: Landesberger, C.; Scherbaum, S.; Weber, J.; Bock, K.; Hiroshima, M.; Oberhofer, B.


Beyne, Eric (General Chair) ; IEEE Components, Packaging, and Manufacturing Technology Society; Institute of Electrical and Electronics Engineers -IEEE-:
4th Electronic System-Integration Technology Conference, ESTC 2012 : Amsterdam, Netherlands, 17 - 20 September 2012
New York, NY: IEEE, 2012
ISBN: 978-1-4673-4645-0
5 S.
Electronics System Integration Technology Conference (ESTC) <4, 2012, Amsterdam>
Fraunhofer EMFT ()

Thin silicon chips with a thickness of 50 m are of light weight and are able to swim on droplets of fluids like for instance water. If the liquid shows a specific wetting behavior with respect to the underlying substrate then droplet and chip can move and self-align. Recent research work was carried out to determine the self-alignment accuracy of 50 m thin silicon dies on plasma programmed surfaces. The self-alignment process sequence for die assembly comprise the following steps: surface programming by CF4 plasma treatment, dispense droplets of water on the metal target areas, pick-up of a 50 m thin chip, move chip tool above the selected target area, let the chip fall down and self-align on the liquid surface on the target area. Within short time the droplet dries off and then the thin die sticks to the substrate. Self-alignment accuracy was measured by infrared microscopy at the position of the alignment marks of top and bottom devices. The paper will report in detai l about sample preparation, selective plasma programming, self-alignment accuracy of thin dies and its dependence of the die size. Furthermore, the chemical composition of the relevant surfaces after CF4 plasma activation were analysed by XPS measurements.