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Mechanical characterization of glass frit bonded wafers

 
: Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.

International Measurement Confederation -IMEKO-, Technical Committee on Experimental Mechanics -TC 15-:
11th IMEKO TC15 Youth Symposium on Experimental Solid Mechanics : Brasov, Romania, 30 May - 2 June 2012
Red Hook, NY: Curran, 2014
ISBN: 9781634394321
S.214-220
Youth Symposium on Experimental Solid Mechanics (YSESM) <11, 2012, Brasov/Romania>
Englisch
Konferenzbeitrag
Fraunhofer IWM ()

Abstract
Wafer bonding is a key technology in the manufacturing of microelectronic and micromechanical systems on industrial scale. Especially glass frit bonding is often used for t he encapsulation of MEMS devices on wafer level. To ensure the reliability of these bonds and to prevent critical failure of the systems, characteristic mechanical properties of the bonded interface are required. The fracture toughness and the shear strength are suitable values to characterize the bonding strength and can be determined by micro chevron and shear testing. They depend on the bonding parameters as well as the test speed. Due to the correlation between measured bonding strength and test speed a maximum test speed has to be identified to obtain reliable failure criteria regarding the fracture toughness and the shear strength.

: http://publica.fraunhofer.de/dokumente/N-350291.html