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Processing, materials, and integration of damascene and 3D interconnects: Preface
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2010
Conference Paper
Titel
Processing, materials, and integration of damascene and 3D interconnects: Preface
Author(s)
Flake, J.
Ritzdorf, T.
Koyangi, M.
Leonte, O.
Mathad, G.S.
Ramm, P.
Rathore, H.S.
Roozeboom, F.
Hauptwerk
Processing, materials, and integration of damascene and 3D interconnects
Konferenz
Symposium Processing, Materials, and Integration of Damascene and 3D Interconnects 2010
Electrochemical Society (Meeting) 2010
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM