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High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
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2010
Conference Paper
Titel
High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Author(s)
Erxleben, R.
Ndip, I.
Brusberg, L.
Schroeder, H.
Toepper, M.
Scheel, W.
Guttowski, S.
Reichl, H.
Hauptwerk
Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM
Konferenz
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components 2010
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM