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Technology options and their influence on routing for interposer-based memory processor integration

Redaktionell betreuter BLOG-Beitrag auf www.3dincites.com; January 28, 2015
 
: Heinig, Andy

:
Volltext (HTML; )

2015
Bundesministerium für Bildung und Forschung BMBF
01M3191D; V3DIM
Bundesministerium für Bildung und Forschung BMBF
16M3201B; ESiMED
Englisch
Elektronische Publikation
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Abstract
Further improvements in system performance are often limited by the achievable bandwidth between processor and memory. 3D integration attracts more and more glob-al players and a multitude of technological options are available to realize high-performance systems. Currently, mainly stacked solutions are considered due to their at-tractive compactness. But designing in a thermally balanced way is very challenging and often ends up in ex-pensive cooling concepts. An alternative is the interposer-based side-by-side arrangement of the systems. In this technology feature we discuss different options (e.g. technology, arrangement) for memory/processor-integration. For silicon interposers two different options for the dielectric material are currently favored; namely SiO2 and polymers. Both materials necessitate their own integration schema. For example SiO2 processing re-quires expensive planarization steps (e.g., CMP – chemical mechanical polishing). Polymer based surfaces don’t re-quire such steps. But because advanced lithography steps require flat surfaces, the achievable resolution of line/space features is low. We compare the presented technology options in the system level context with the interconnections between a memory and a processor. For this comparison we consider the overall costs and the achievable data rate of the processor/memory interface.

: http://publica.fraunhofer.de/dokumente/N-349849.html