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On double sided cooling

: Feix, G.; Hutter, M.; Hoene, E.; Lang, K.-D.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
ESTC 2014, Electronics System Integration Technology Conference : Helsinki, Finland; 16.09. - 18.09.2014
Piscataway, NJ: IEEE, 2014
ISBN: 978-1-4799-4026-4
ISBN: 978-1-4799-4027-1
ISBN: 978-1-4799-4025-7
Electronics System Integration Technology Conference (ESTC) <5, 2014, Helsinki>
Fraunhofer IZM ()

Since about 15 years back, there were several attempts to increase power density by double-sided cooling of power semiconductors, mostly by a sandwich stack with two DCBs. This paper gives an overview over the developments and approaches over the last years and some results of another project concerning double sided cooling.