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Mechanical reliability of directly bonded silicon MEMS components

: Bagdahn, J.; Wiemer, M.; Petzold, M.

Hobart, K.D. ; Electrochemical Society -ECS-, Electronics Division:
Semiconductor wafer bonding VIII. Science, technology, and applications : Proceedings of the international symposium; Eighth International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications, held in May 2005 in Quebec City, Canada, as part of the 2005 spring meeting of the Electrochemical Society
Pennington: Electrochemical Society, 2005 (Electrochemical Society. Proceedings 2005-2)
ISBN: 1-566-77460-8
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications <8, 2005, Quebec>
Electrochemical Society (Spring Meeting) <2005, Quebec>
Fraunhofer IWM ()
MEMS; silicon; wafer bonding

Duringe use, directly wafer-bonded devices such as acceleration sensors, gyroscopes, micropumps, or microvalves are oxposed to continuously or periodically acting mechanical stresses particularly due to vibration, thermo-mechnical mismatch, or internal and external pressures. For theses kind of applications an proven strength and long-term reliability is required. It will be shown in that pater that fracture mechnical approaches can be applied for strength and lifetime analys es of wafer-bondet devices. These approaches consider the influence of bonding defects, micromachined structures in the bonded interface, the fracture mechanical properties of the interface as well as the loading situation.