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Application of 3D-stacking technology for sensor integration and miniaturization

: Amiri Jam, K.; Großer, V.; Lang, K.-D.; Reichl, H.

Reichl, H. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies 2005 : Micro Electro, Opto, Mechanical Systems & Components International Conference & Exhibition, October 5-6, 2005, Munich, Germany
Poing: Franzis, 2005
ISBN: 3-7723-7040-3
International Conference on Micro Electro, Opto, Mechanical Systems & Components <2005, München>
Fraunhofer IZM ()
3D-PCB stacking technology; miniaturization of sensor system; 3D system; self-sufficient wireless sensor system; 3D packaging; 3D-stacking; FR4; design rules for 3D-package

Abstract Advanced 3D-stacking-technology on FR4-basis has now reached a degree of matur-ity where it can be used for many electronics applications. This technology is used whenever a higher miniaturization of components or systems and a reduction of costs are required. Efficient solutions can be achieved with standard assembly technolo-gies, such as SMT (surface mount technology), COB (chip on board) or FCOB (flip chip on board). One important operational area of application for 3D-stacking-technology is the field of sensor development and wireless sensor networking. This contribution is concerned with the electrical design, the technologies and the realization of 3D-stacking-technology within this field.