Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

DTIP 2015, 17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

27 - 30 April 2015, Montpellier, France

: Benoit, Charlot; Mita, Yoshio; Nouet, Pascal; Pressecq, Francis; Schröpfer, Gerold; Rencz, Marta; Schneider, Peter

: Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society

	Piscataway, NJ: IEEE, 2015, XIV, 392 S. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS <17, 2015, Montpellier> ISBN: 978-1-4799-8627-9 ISBN: 978-1-4799-8545-6 ISBN: 978-1-4799-8625-5

	Englisch
	Tagungsband
	Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()
	modeling; smart systems; manufacturing; MEMS; RF devices; simulation; integrated process