Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Pluggable electro-optical circuit board interconnect based on embedded graded-index planar glass waveguides

: Pitwon, R.C.A.; Brusberg, L.; Schröder, H.; Whalley, S.; Wang, K.; Miller, A.; Stevens, P.; Worrall, A.; Messina, A.; Cole, A.


Journal of Lightwave Technology 33 (2015), Nr.4, S.741-754
ISSN: 0733-8724
European Commission EC
FP7-ICT; 318240; PhoxTroT
Fraunhofer IZM ()

Widespread adoption of electro-optical circuit boards based on embedded glass waveguide technology would enable seamless optical connectivity from external fiber-optic networks to system embedded optical interconnect architectures. In this paper, we report on the fabrication of planar multimode waveguides within thin glass foils based on a two-step thermal ion exchange process. Novel lamination techniques were developed to allow glass waveguide panels to be reliably integrated into a conventional electronic multilayer printed circuit board. In addition, a complete suite of optical connector technologies were developed to enable both direct fiber-to-board and board-to-board connectivity. We present the design, development, and characterization of a fully integrated connection platform, comprising a 281 x 233 mm(2) multilayer electro-optical backplane with integrated planar glass waveguides, a pluggable connector system, and five pluggable test cards. Both on-card and externally generated 850 and 1310-nm optical test data were conveyed through the connector and waveguide system and characterised for in-system and system-to-system optical connectivity at data rates up to 32 Gb/s per channel exhibiting bit error rates of less than 10(-12).