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Breakdown of Elasticity in Copper and Aluminium Interconnects

 
: Schreiber, J.; Melov, V.G.; Herms, M.

Michel, B.; Winkler, T.; Werner, M.; Fecht, H.-J. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; Deutscher Verband für Materialforschung und -prüfung e.V. -DVM-, Berlin:
MicroMat 2000. Proceedings 3rd International Conference and Exhibition Micro Materials : April 17 - 19, 2000, Berlin, Germany
Dresden: ddp Goldenbogen, 2000
ISBN: 3-932434-15-3
S.679-682
Micro Materials (Micro Mat) <3, 2000, Berlin>
Englisch
Konferenzbeitrag
Fraunhofer IZFP ()
mechanical property; semiconductor device; copper; aluminium

Abstract
Applying a non-destructive approach to test the mechanical properties metallic interconnections highly constrained in two dimensions anomalies were found, which can be explained by the breakdown of elasticity perpendiculary to the line direction. This feature may have strong consequences for the mechanical reliability of Cu interconnects in semiconductor devices.

: http://publica.fraunhofer.de/dokumente/N-3333.html