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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Technology, simulation and design for 3D integrated heterogeneous sensor systems

 
: Schneider, Peter; Heinig, Andy; Bayer, Christian; Ramm, Peter; Dal Molin, Renzo; Fleischer, Maximilian

Mecray, M.C.:
11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference, ASIP 2014 : The Technology and Market Landscape for Device and Systems Integration and Interconnect; December 10-12, 2014, Burlingame, California
Burlingame/Calif., 2014
36 Folien
3D Architectures for Semiconductor Integration and Packaging Conference (ASIP) <11, 2014, Burlingame/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

: http://publica.fraunhofer.de/dokumente/N-330416.html