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RF/microwave modeling and comparison of buried, blind and through-hole vias

: Ndip, I.; John, W.; Reichl, H.


Toh, K.C. ; Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section; IEEE Components, Packaging, and Manufacturing Technology Society; International Microelectronics and Packaging Society -IMAPS-:
6th Electronics Packaging Technology Conference, EPTC 2004. Proceedings : 8 - 10 December 2004, Pan Pacific Hotel, Singapore
Piscataway, NJ: IEEE Service Center, 2004
ISBN: 0-7803-8821-6
ISBN: 0-7803-8822-4
Electronics Packaging Technology Conference (EPTC) <6, 2004, Singapore>
Fraunhofer IZM ()

In order to efficiently design multilayered chip packages and boards for RF/high-speed applications, a comparative study of different via configurations, as well as appropriate design measures to prevent their parasitic effects from degrading the entire system performance is needed. In this paper, we present a comparison between buried, blind and through-hole vias based on their full-wave electromagnetic (EM) field simulation, equivalent circuit modeling and RF measurement results. From this comparison, design recommendations that can be used to reduce/eliminate signal degrading effects caused by these vias were deduced for frequencies up to 30GHz.