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Vertical system integration by using inter-chip vias and solid-liquid interdiffusion bonding

: Klumpp, A.; Merkel, R.; Ramm, P.; Weber, J.; Wieland, R.


Japanese Journal of applied physics. Part 2, Letters 43 (2004), Nr.7A, L829-L830
ISSN: 0021-4922
Fraunhofer IZM ()

A new approach for 3D system integration, called Inter Chip Via-Solid Liquid Interdiffusion (ICV-SLID) is introduced. This is a new chip-to-wafer stacking technology which combines the advantages of the Inter Chip Via (ICV) process and the solid-liquid-interdiffusion technique (SLID) of copper and tin. The fully modular ICV-SLID concept allows the formation of multiple device stacks. A test chip was designed and the total process sequence of the ICV-SLID technology for the realization of a three-layer chip-to-wafer stack was demonstrated. The proposed wafer-level 3D integration concept has the potential for low cost fabrication of multi-layer high-performance 3D-SoCs and is well suited as a replacement for embedded technologies based on monolithic integration.