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High precision passive alignment flip chip assembly using self alignment and micromechanical stops

 
: Hutter, M.; Oppermann, H.; Engelmann, G.; Reichl, H.

:

Toh, K.C. ; Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section; IEEE Components, Packaging, and Manufacturing Technology Society; International Microelectronics and Packaging Society -IMAPS-:
6th Electronics Packaging Technology Conference, EPTC 2004. Proceedings : 8 - 10 December 2004, Pan Pacific Hotel, Singapore
Piscataway, NJ: IEEE Service Center, 2004
ISBN: 0-7803-8821-6
ISBN: 0-7803-8822-4
S.385-389
Electronics Packaging Technology Conference (EPTC) <6, 2004, Singapore>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/N-32910.html