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Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps
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2004
Conference Paper
Titel
Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps
Author(s)
Hutter, M.
Hohnke, F.
Oppermann, H.
Klein, M.
Engelmann, G.
Hauptwerk
54th Electronic Components & Technology Conference 2004. Proceedings. Vol.1
Konferenz
Electronic Components and Technology Conference (ECTC) 2004
DOI
10.1109/ECTC.2004.1319314
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM