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Phase change based thermal buffering of transient loads for power converter

: Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R.


Institute of Electrical and Electronics Engineers -IEEE-:
20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014 : September 24 - 26, 2014, Greenwich, London
Piscataway, NJ: IEEE, 2014
ISBN: 978-1-4799-5415-5 (online)
ISBN: 978-1-4799-5416-2 (print)
7 S.
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <20, 2014, London>
Fraunhofer ENAS ()
Fraunhofer IZM ()

This paper deals with the system design, technology and test of a novel concept of integrating silicon power dies along with thermo-electric coolers and a phase change heat buffer in order to thermally manage transients occurring during operation. The innovative power-electronics concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering and sintering. To avoid a cold plate at the backside, a new low-cost, low-footprint thermal storage device has been developed and optimized by simulation to meet the requirements given by this application. Coupled-field simulations are used to predict thermal performance and are being verified by especially designed test stands.