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Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test

: Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014. Vol.2 : Lake Buena Vista, Orlando, Florida, USA, 27 - 30 May 2014
Piscataway, NJ: IEEE, 2014
ISBN: 978-1-4799-5268-7
ISBN: 978-1-4799-5267-0
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) <14, 2014, Lake Buena Vista/Fla.>
Fraunhofer ENAS ()
Fraunhofer IZM ()

This paper deals with the system design, technology and test of a novel concept of integrating Silicon power dies along with thermo-electric coolers and a phase change heat buffer in order to thermally manage transients occurring during operation. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering and sintering. Coupled-field simulations are used to predict thermal performance and are verified by especially designed test stands to very good agreement.