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Development of a robust, ceramic MEMS-package for hermetically sealed and highly shock-resistant SMD-devices

: Goldberg, Adrian; Ihle, Martin; Ziesche, S.; Külls, Robert


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
ESTC 2014, Electronics System Integration Technology Conference : Helsinki, Finland; 16.09. - 18.09.2014
Piscataway, NJ: IEEE, 2014
ISBN: 978-1-4799-4026-4
ISBN: 978-1-4799-4027-1
ISBN: 978-1-4799-4025-7
Electronics System Integration Technology Conference (ESTC) <5, 2014, Helsinki>
Fraunhofer IKTS ()
Fraunhofer EMI ()

The Low-Temperature Cofired Ceramic Technology (LTCC) based package shown here is an example of a special customized surface mount device (SMD) solution following the requirements of a high-g acceleration sensor. The main focus was the development of an economically viable packaging-solution. For achieving this goal attention was paid to the aspects of cost reduction by miniaturization and to the use of cost-effective materials. LTCC was chosen as the preferred manufacturing technology because of the possibility to integrate electrical wiring inside the ceramic. Using this technology a ceramic packaging with gas-tight sealing, solderable SMD contacts and an electrically and mechanically stable solution could be developed and manufactured.