English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Stress Analysis on Cu Through-Silicon Vias with Micro-Raman Spectroscopy
Details
Full
Export
Statistics
Options
2014
Conference Paper
Titel
Stress Analysis on Cu Through-Silicon Vias with Micro-Raman Spectroscopy
Author(s)
Bayat, Parisa
Vogel, D.
Rodriguez, Raul D.
Sheremet, E.
Zahn, Dietrich R.T.
Rzepka, Sven
Michel, Bernd
Hauptwerk
MAM 2014, Workshop on "Materials for Advanced Metallization". CD-ROM
Konferenz
Workshop on "Materials for Advanced Metallization" (MAM) 2014
Language
English
google-scholar
View Details
Fraunhofer-Institut für Elektronische Nanosysteme ENAS