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Verfahren zur Behandlung und/oder Recycling von Säge-Slurries

METHOD FOR THE TREATMENT AND/OR RECYCLING OF SAWING SLURRIES
 
: Azizi, Maral

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Frontpage ()

DE 102012017183 A1: 20120830
Deutsch
Patent, Elektronische Publikation
Fraunhofer IISB ()

Abstract
The present invention relates to a method for the treatment and/or recycling of sawing slurries, particularly of semiconductor materials, arising in mechanical cutting methods. The sawing slurries contain particles of semiconductor materials and silicon carbide and/or diamond particles. The method according to the invention specifies a two-stage treatment and/or recycling process in which, in a first stage, the slurries are treated at temperatures below the melting point of the semiconductor material and, in a second stage, the product obtained from the first stage is treated above the melting point of the semiconductor material. At least during the first stage and/or during the second stage, the slurry is introduced into a gas flow and/or a gas flows through and/or washes around it.

: http://publica.fraunhofer.de/dokumente/N-311017.html