Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Assembly for non-destructive monitoring or inspection of components using sound wave analysis

Anordnung zur zerstörungsfreien Überwachung oder Prüfung von Bauteilen mittels Schallwellenanalyse
: Klesse, Thomas

Frontpage ()

EP 2541541 A1: 20110630
Patent, Elektronische Publikation
Fraunhofer IKTS ()

The arrangement has an electronic signal processing unit (1), a sound wave transducer (2) and a waveguide (3) that is provided for the transmission of the sound waves to or from a to be monitored or tested component (4). A clamping device (5) is provided for fixing the waveguide on the component. The waveguide is formed in the shape of a wire or a fiber and is cohesively attached to the component surface in a detection area through the clamping device. The clamping device is formed as a clamp or a tightening strap. The waveguide is made of a metal, a metal alloy, a polymer or a glass.