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New Manufacturing Concepts with Line-integrated Plating Process

 
: Holeczek, H.; Bolch, T.

American Electroplaters and Surface Finishers Society -AESF-, Orlando/Fla.:
Finishing Technology into the Millenium. Proceedings AESF SUR/FIN 2000 Annual International Technical Conference
Chicago, Ill., 2000
SUR/FIN <2000, Chicago/Ill.>
Englisch
Konferenzbeitrag
Fraunhofer IPA ()
Schutzschicht; Fertigung; trend

Abstract
Today's customers and markets demand more flexibility, cost efficiency and shorter delivery times. On the other hand, metal surface layers gain more importance for technical abilities and qualities of products, so the trend to partially or fully integrated plating processes in manufacturing lines starts today. Basic concepts and ideas of line integration will be explained and technological challenges will be described. Several examples of existing integrated processes and their advantages will be described in detail. Research goals and development trends will be explained that will pave the way to exploit the unused potential of plating processes through the use of line integration.

: http://publica.fraunhofer.de/dokumente/N-3076.html