English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Vacuum wafer bonding technology
Details
Full
Export
Statistics
Options
2004
Conference Paper
Titel
Vacuum wafer bonding technology
Author(s)
Reinert, W.
Hauptwerk
IMAPS Nordic Annual Conference 2004. Proceedings. CD-ROM
Konferenz
International Microelectronics and Packaging Society (IMAPS Nordic Annual Conference) 2004
Language
English
google-scholar
View Details
Fraunhofer-Institut für Siliziumtechnologie ISIT