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Fraunhofer cluster 3D integration

: Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried

Surface Mount Technology Association -SMTA-:
Pan Pacific Microelectronics Symposium, PAN PAC 2014 : Held 11 - 13 February 2014, Kohala Coast, Hawaii, USA
Red Hook, NY: Curran, 2014
ISBN: 978-1-63266-060-2
Pan Pacific Microelectronics Symposium (PAN PAC) <2014, Kohala Coast/Hawaii>
Fraunhofer IZM ()
Fraunhofer ENAS ()
Fraunhofer EAS ()
Fraunhofer IKTS ()
Mikroelektronik; Synergie; 3D integration

3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for the industry in Germany, Europe and worldwide. To meet the complexity of this technological approach, the Fraunhofer institutes IZM, ENAS, IISEAS, IKTS cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. This supports the strengthening of Germany as a center of innovation and economy and its leading role as a driver for innovative products in the field of microelectronic system integration.
The presentation will show the complex correlation of the different aspects of 3D integration and demonstrate the synergies that are met by the new Fraunhofer cluster and that enable the positioning as a competent and broad project, technology and service partner for industrial clients.