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Dispersion-strengthened copper-based materials formed by high rate magnetron/plasmatron sputtering
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1979
Journal Article
Titel
Dispersion-strengthened copper-based materials formed by high rate magnetron/plasmatron sputtering
Author(s)
Häußler, G.
Daut, H.-H.
Schiller, S.
Heisig, U.
Goedicke, K.
Hempel, W.
Zeitschrift
Thin solid films
Konferenz
International Conference on Metallurgical Coatings 1979
DOI
10.1016/0040-6090(79)90113-5
Language
English
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Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik FEP