Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Reliability improvements in electronic systems by combining condition monitoring approaches

: Jerchel, K.; Kruger, M.; Middendorf, A.; Nissen, N.F.; Lang, K.-D.

Volltext urn:nbn:de:0011-n-3016497 (682 KByte PDF)
MD5 Fingerprint: e76c038b4bf8728b8a4f94a94e44e86a
Erstellt am: 28.11.2014

Institute of Electrical and Electronics Engineers -IEEE-:
International Conference on Electronics Packaging, ICEP 2014 : 23-25 April 2014, Toyama, Japan
Piscataway, NJ: IEEE, 2014
ISBN: 978-4-904090-10-7
International Conference on Electronics Packaging (ICEP) <2014, Toyama>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IZM ()

This paper gives an overview of different methods of condition monitoring (parameter measurement, canary principle, life cycle unit). It describes the advantage of combining the condition monitoring (CM) methods to improve the reliability of electronic systems. A workflow to implement CM methods is described as well as different system levels and the associated applicable CM method. The paper concludes with the example of an electronic system and a concept to monitor the whole system by means of all three CM methods.