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Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments

: Maus, I.; Preu, H.; Niessner, M.; Fink, M.; Jansen, K.M.B.; Pantou, R.; Michel, B.; Wunderle, B.

DOI: 10.1109/EuroSimE.2014.6813833

	Institute of Electrical and Electronics Engineers -IEEE-: 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 : 7-9 April 2014, Ghent , Belgium Piscataway, NJ: IEEE, 2014 ISBN: 978-1-4799-4791-1 (Print) ISBN: 978-1-4799-4790-4 S.400-406
	International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <15, 2014, Ghent>

	Englisch
	Konferenzbeitrag
	Fraunhofer ENAS ()

Abstract
Microelectronic devices integrate more and more diverse materials in order to miniaturize the packages. Epoxy resins enable smaller electronic devices with promising features [1]. The performance and the reliability of the product are highly dependent on the material behavior of the components and on their interaction under different loading situation.

: http://publica.fraunhofer.de/dokumente/N-301510.html