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2014
Conference Paper
Titel
Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments
Abstract
Microelectronic devices integrate more and more diverse materials in order to miniaturize the packages. Epoxy resins enable smaller electronic devices with promising features [1]. The performance and the reliability of the product are highly dependent on the material behavior of the components and on their interaction under different loading situation.
Author(s)