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Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips

: Rezaie Adli, A.R.; Jansen, K.M.B.; Schindler-Saefkow, F.; Rost, F.

DOI: 10.1109/EuroSimE.2014.6813837

	Institute of Electrical and Electronics Engineers -IEEE-: 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 : 7-9 April 2014, Ghent , Belgium Piscataway, NJ: IEEE, 2014 ISBN: 978-1-4799-4791-1 (Print) ISBN: 978-1-4799-4790-4 S.425-428
	International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <15, 2014, Ghent>

	Englisch
	Konferenzbeitrag
	Fraunhofer ENAS ()

Abstract
This paper describes a method used for experimental real-time monitoring of thermo-mechanical stress build-up during integrated circuit encapsulation. To detect the stress variations during molding, special stress measuring chips were employed. The working principle of the stress chip is based on the piezoresistive sensors embedded on the surface in a 6 by 6 matrix distribution. [1]

: http://publica.fraunhofer.de/dokumente/N-301381.html