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Array fiber welding on micro optical glass substrates for chip-to-fiber coupling

: Schröder, H.; Neitz, M.; Brusberg, L.; Queiser, M.; Arndt-Staufenbiel, N.; Lang, K.-D.


Schröder, H. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Optical interconnects XIV : 3 - 5 February 2014, San Francisco, California, United States
Bellingham, WA: SPIE, 2014 (Proceedings of SPIE 8991)
ISBN: 978-0-8194-9904-2
Paper 89910F, 9 S.
Conference "Optical Interconnects" <14, 2014, San Francisco/Calif.>
Fraunhofer IZM ()

High bandwidth parallel optical transceivers are highly demanded for optical interconnects in data centers and in high performance computing. Such transceivers are composed of VCSEL- and photodiode components which have to be fiber coupled, and the appropriate driving and amplifying circuitry. For high density fiber optical connectors lens arrays for improved coupling efficiency have to be used. We propose an advantageous adhesive free method to interconnect optical fibers with such kind of lens arrays. Common approaches using adhesive bonding have high challenges in terms of yield, reliability and optical performance. We introduce our novel fiber welding approach for joining directly fused silica fibers on borosilicate glass substrates with integrated micro optics, e.g. lenses and lens arrays. It is a thermal process with a precise heat input by CO2-laser processing, which is combinable with sequential passive or active alignment of each single fiber to the substrate c ausing flexibility and highest coupling efficiencies. Since the fiber is accessed only from one side, a two dimensional high-density fiber array can be realized. The manufacturing time of such an interconnection is very short. Due to the adhesive free interface high power transmission is enabled and the occurrence of polymer caused misalignment and degradation are prevented. The paper presents current results in thin glass-based opto-electronic packaging. In particular our laboratory setup for array fiber welding and experimental results of such connections will be discussed and compared to UV-adhesive joining. Also further investigation, for example optical characterization and reliability tests are included. Finally a machine concept, which is under development, will be discussed.