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Multi-scale materials data for 3D TSV stack performance simulation and model validation

 
: Zschech, E.

International Microelectronics and Packaging Society -IMAPS-:
9th International Conference and Exhibition on Device Packaging, DPC 2013 : Scottsdale/Fountain Hills, Arizona, USA, 11-14 March 2013
Red Hook, NY: Curran, 2013
ISBN: 978-1-62748-774-0
S.253-271
International Conference and Exhibition on Device Packaging <9, 2013, Scottsdale/Ariz.>
Englisch
Konferenzbeitrag
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

: http://publica.fraunhofer.de/dokumente/N-300870.html