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3D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bonding
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2013
Conference Paper
Titel
3D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bonding
Author(s)
Hofmann, Lutz
Baum, Mario
Schulz, Stefan E.
Wiemer, Maik
Geßner, Thomas
Hauptwerk
Advanced Metallization Conference 2013
Konferenz
Advanced Metallization Conference (AMC) 2013
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS