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Development of embedded high power electronics modules for automotive applications
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2013
Conference Paper
Titel
Development of embedded high power electronics modules for automotive applications
Author(s)
Böttcher, L.
Hauptwerk
9th International Conference and Exhibition on Device Packaging, DPC 2013
Konferenz
International Conference and Exhibition on Device Packaging 2013
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM