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Heterointegration technologies for high frequency modules based on film substrates

 
: Bock, K.

2013 International Conference on Compound Semiconductor Manufacturing Technology. Digest of papers : May 13th - 16th, 2013, Hilton New Orleans Riverside, New Orleans, Louisiana, USA
Beaverton/Or.: CS MANTECH, 2013
ISBN: 978-1-893580-21-3
S.319-322
International Conference on Compound Semiconductor Manufacturing Technology <2013, New Orleans/La.>
Englisch
Konferenzbeitrag
Fraunhofer EMFT ()

Abstract
System integration technology requires multifunctionality and in many cases energy autarkic systems, very cost-efficient or open form factor solutions. Integration in plastic or foil substrates by a flex-to-flex integration concept shows the potentially free form factor which allows placing of film based systems on curved surfaces or in housings of very low thickness. Such technologies are not limited to flexible applications. They are available for optimized rigid modules and improve the heat sink by thinning and foil handling of transceiver chips or power devices. Thin semiconductor technologies are not limited to silicon, enabling also heterointegration with compound semiconductors. Meanwhile it is possible to integrate high frequency interconnects and printed passives in plastic foil and thin silicon interposer. Possible application scenarios are large area electronics in ceilings panels of cars or mobile communication systems for the "internet of things and humans".

: http://publica.fraunhofer.de/dokumente/N-300518.html